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61

Thermo-mechanical Stress Analysis for Planar Metallization in Integrated Power Electronics Modules

Autoren:
Zhu, N.; Wyk, J. D. van; Liang, Z. X.
Konferenz:
CIPS 2006 - 4th International Conference on Integrated Power Systems

62

Time and spatial resolved detection of power device failures during wire bonding

Autoren:
Siepe, Dirk; Bayerer, Reinhold
Konferenz:
CIPS 2006 - 4th International Conference on Integrated Power Systems

63

Towards an integrated inverter based on lateral JFET SiC

Autoren:
Gié, J.; Lazar, M.; Planson, D.; Bergogne, D.; Bevilacqua, P.; Allard, B.; M'Rad, S.
Konferenz:
CIPS 2006 - 4th International Conference on Integrated Power Systems