1
Thermo-mechanical Stress Analysis for Planar Metallization in Integrated Power Electronics Modules
Autoren:
Zhu, N.; Wyk, J. D. van; Liang, Z. X.
Konferenz:
CIPS 2006 - 4th International Conference on Integrated Power Systems
2
Time and spatial resolved detection of power device failures during wire bonding
Autoren:
Siepe, Dirk; Bayerer, Reinhold
Konferenz:
CIPS 2006 - 4th International Conference on Integrated Power Systems
3
Towards an integrated inverter based on lateral JFET SiC
Autoren:
Gié, J.; Lazar, M.; Planson, D.; Bergogne, D.; Bevilacqua, P.; Allard, B.; M'Rad, S.
Konferenz:
CIPS 2006 - 4th International Conference on Integrated Power Systems