Anzeige
Sortierung
Seite 2 von 4

21

Effect of Diamonds on Pad Recovery in Oxide and Metal Pad Conditioning Process

Autoren:
Kang, Bong-Kyun; Kang, Young-Jae; Kim, Kyu-Chae; Park, Jin-Goo; Lee, Joo-Hwan; Ahn, Jung-Su
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

22

Effect of Pad Hole on ECMP process

Autoren:
Jeong, Sukhoon; Lee, Sangjik; Park, Jaehong; Kim, Hyoungjae; Jeong, Haedo
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

23

Effect of polish stopper film in STI-CMP for 45nm node devices and beyond

Autoren:
Watanabe, Takashi; Shibata, Seiichi; Idani, Naoki; Nakamura, Makoto; Tamura, Yasuyuki; Kase, Masataka; Miyajima, Motoshu
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

24

Effect of Slurry pH on Poly Silicon CMP

Autoren:
Kang, Young-Jae; Kang, Bong-Kyun; Park, Jin-Goo; Hong, Yi-Koan; Han, Sang-Yeob; Yun, Seong-Kyu; Yoon, Bo-Un; Hong, Chang-Ki
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

25

Enhanced control and manufacturing for CMP processing with advanced blending and delivery of slurries

Autoren:
Liu, Guojun; Moulton, Russell; Flores, Gary; Han, Leon
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

26

Evaluation and de-coupling of electrochemical and mechanical effects of diluted WCMP commercial slurry on tungsten removal rate

Autoren:
Gianni, Davide M.; Gianni, Davide M.; Mazzarolo, Alice; Masciocchi, Norberto; Maspero, Angelo; Spinolo, Giulia; Vicenzo, Antonello
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

27

Evaluation of Cu CMP Barrier Slurries for Ultra Low-k dielectric film (k~2.4) for 45nm technology

Autoren:
Zhao, Feng; Economikos, Laertis; Tseng, Wei-tsu; Kim, Hyun-ki; Engbrecht, Edward; Standaert, Theodorus E.; Li, Jing Hui; Liu, Wu Ping; Chae, Moosung; Nicholson, Lee M.; Sankaran, Sujatha
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

28

Experimental Analysis on CMP Mechanism of Single Crystal SiC

Autoren:
Lee, Houjun; Jeong, Sukhoon; Seo, Heondeok; Park, Beomyoung; Oh, Jiheon; Jeong, Haedo; Kim, Hyoungjae
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

29

Fabrication of Surface Acoustic Wave Structures with buried Copper IDTs using the Copper Damascene Process

Autoren:
Menzel, S.; Reitz, D.; Künzelmann, U.; Albert, M.; Bartha, J.-W.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

30

Full Sequence Ecmp for Advanced Low Stress Copper Planarization

Autoren:
Groschopf, Johannes; Steffen, Katja; Donohoe, Ray; Kober, Christian; Richter, Dirk; Kramer, Jens; Seidel, Robert; Grillberger, Michael; Gu, Haiyang; Hu, Yongqi; Wang, You; Wang, Yuchun
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

31

Full-Chip CMP Simulation System

Autoren:
Fukuda, Daisuke; Shibuya, Toshiyuki; Idani, Naoki; Karasawa, Toshiyuki
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

32

Greenwood-Williamson Model for Pattern-Dependent Planarization

Autoren:
Rzehak, Roland; Vasilev, Boris
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

33

Impact of a High Pressure Micro Jet (HPMJ) on the conditioning and cleaning of unwoven fabric polyester pads in silicon polishing

Autoren:
Miyachi, Keiji; Seike, Yoshiyuki; Haba, Shinichi; Kurokawa, Syuhei; Doi, Toshiro K.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

34

Impact of ceria properties and CMP parameters on STI CMP performance

Autoren:
Messemaeker, Jo De; Sinapi, Fabrice; Ong, Patrick; Put, Stijn; Nelis, Daniël; Bosch, Jeroen van den; Strauven, Yvan; Lippens, Paul; Devriendt, Katia
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

35

Improvements of Electrical and Optical Property of Organic Light Emitting Diode using Chemical Mechanical Polishing Process

Autoren:
Choi, G. W.; Lee, W. S.; Seo, Y. J.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

36

In-Situ Investigation of Wafer-Slurry-Pad Interactions during CMP

Autoren:
Braun, N.; Gray, C.; Mueller, A.; Vlahakis, J.; Gauthier, D.; Manno, V. P.; Rogers, C.; White, R.; Anjur, S.; Moinpour, M.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

37

Influence of Pad Structures on Slurry Performance for Cu CMP

Autoren:
Li, Yuzhuo; Cheemalapathi, Krishnayya; Wang, Changxue; Tetsujiro, Tada; Arahata, Takashi; Kodaba, Ichiro; Watanabe, Jun
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

38

Influence of STI Trench Fill and Dummy Design on CMP Behavior

Autoren:
Ong, P.; Devriendt, K.; Redolfi, A.; Okuno, Y.; Hernandez, J. L.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

39

Influence of the wafer shape on polishing performance for 300 mm prime wafer polishing

Autoren:
Langenkamp, M.; Kanzow, J.; Mörsch, G.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

40

Insitu Characterization of Cu CMP with peroxide based slurries containing arginine as complexing agent

Autoren:
Prasad, Y. Nagendra; Ramanathan, S.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology