1
The Optimized Gate Driver Design Techniques for IGBT Properties and Downsizing in Eco-Friendly Vehicle
Autoren:
Jeong, KangHo; Lee, KiJong; Jang, JiWoong; Shin, SangChul; Jang, KiYoung; Jung, JinHwhan
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
2
The Potential of Household Specific Feature Selection for Analysing Smart Home Time-Series Data
Autoren:
Hausmann, Marc-David; Ziekow, Holger
Konferenz:
Smart SysTech 2016 - European Conference on Smart Objects, Systems and Technologies
3
The Seven Challenges of LED Lighting
Autoren:
Adragna, Claudio; Ferrazza, Francesco; Gritti, Giovanni
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
4
The Three-Transponder Method: A Novel Approach for Traceable (E)RCS Calibration of SAR Transponders
Autoren:
Doering, Bjoern J.; Reimann, Jens; Raab, Sebastian; Jirousek, Matthias; Rudolf, Daniel; Schwerdt, Marco
Konferenz:
EUSAR 2016 - 11th European Conference on Synthetic Aperture Radar
5
The Use of the L2-Norm for the Analysis of Texture on PolSAR Data
Autoren:
Deng, Xinping; Lopez-Martinez, Carlos
Konferenz:
EUSAR 2016 - 11th European Conference on Synthetic Aperture Radar
6
Theoretical study of mode coupling via the gain medium in FM-EDFA including mode beating effects
Autoren:
Trinel, Jean-Baptiste; Le Cocq, Guillaume; Vanvincq, Olivier; Quiquempois, Yves; Andresen, Esben Ravn; Bigot, Laurent
Konferenz:
ECOC 2016 - 42nd European Conference on Optical Communication
7
Therapieassistenz bei neuromuskulären Erkrankungen: Ergebnisse des Projektes NASFIT
Autoren:
Hein, Albert; Feldhege, Frank; Mau-Möller, Anett; Bader, Rainer; Zettl, Uwe K.; Kirste, Thomas
Konferenz:
Zukunft Lebensräume - Kongress
8
Thermal conductivity of Al2O3 substrates and precise 3D layer reconstruction – Key parameters for matching FEM simulations with thermal measurements
Autoren:
Amende, Tony; Friedrich, Matthias; Endres, Michael; Pihale, Sven; Schmidt, Ralf
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
9
Thermal Evaluation of a 200A NPC2 Module used in a 3-level Inverter up to 60 kW
Autoren:
Ma, Sichao
Konferenz:
PCIM Asia 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10
Thermal Impedance Identification of a SiC JFET Module
Autoren:
Merkert, Arvid; Weber, Simon; Mertens, Axel
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
11
Thermal management of future WBG devices using two-phase cooling
Autoren:
Joshi, Shailesh N.; Dede, Ercan M.
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
12
Thermal modelling and management for increasing the power density in high current power electronic systems
Autoren:
Schilling, Marco; Koehnlechner, Benjamin; Schwalbe, Ulf; Reimann, Tobias
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
13
Thermal Performance and Reliability of Copper Thick Film Substrates
Autoren:
Gundel, Paul; Nowak, Torsten; Bawohl, Melanie; Challingsworth, Mark; Czwickla, Christoph; Garcia, Virginia; Nikolaidis, Ilias; Modes, Christina; Persons, Ryan; Reitz, Jessica; Shahbazi, Caitlin
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
14
Thermal Performance of High-Temperature Stable Die-Attachments for GaN HEMTs
Autoren:
Bajwa, A. A.; Reiner, R.; Quay, R.; Wilde, J.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
15
Thermische Sicherheitsüberwachung in der HV-DC Messumgebung der PTB
Autoren:
Schlüterbusch, Christoph; Seckelmann, Michael; Hahne, Julian; Meisner, Johann
Konferenz:
VDE-Hochspannungstechnik 2016 - ETG-Fachtagung
16
Thermisches Management von Hochtemperaturelektronik mit leistungsfähigen Kompositmaterialien
Autoren:
Novikov, A.; Strehse, C.; Lexow, D.; Nowottnick, M.
Konferenz:
Elektronische Baugruppen und Leiterplatten – EBL 2016 - 8. DVS/GMM-Tagung
17
Thermo-fluidisch gekoppelte Untersuchung von Flip-Chips auf einer Leiterplatte
Autoren:
Schacht, R.; Punch, J.; Merten, E.; Rzepka, S.; Michel, B.
Konferenz:
Elektronische Baugruppen und Leiterplatten – EBL 2016 - 8. DVS/GMM-Tagung
18
Thermo-Mechanical Stress Investigations on Newly Developed Passive Balancing Board for Battery Management Systems
Autoren:
Otto, Alexander; Schindler-Saefkow, Florian; Rzepka, Sven; Haase, Sven; Scheiter, Lutz; Hofer, Guenter; Armengaud, Eric
Konferenz:
AmE 2016 – Automotive meets Electronics - 7. GMM-Fachtagung
19
Thin-Film Based Microtransformer Suitable for High Switching Frequency Power Applications
Autoren:
Dinulovic, Dragan; Shousha, Mahmoud; Haug, Martin; Beringer, Sebastian; Wurz, Marc C.
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
20
Three-dimensional High Resolution Imaging Method of Multi-pass Circular SAR Based on Joint Sparse Model
Autoren:
Zhu, Shiheng; Zhang, Zenghui; Liu, Bin; Yu, Wenxian
Konferenz:
EUSAR 2016 - 11th European Conference on Synthetic Aperture Radar