IEC 60749-22:2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Ausgabedatum:
2002-09
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 41 VDE-Artnr.: 210139
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.The contents of the corrigendum of August 2003 have been included in this copy.