IEC 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Ausgabedatum:
2003-02
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 11 VDE-Artnr.: 210500
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. Generally only applicable to cavity packages or as a process monitor.