IEC 60749-14:2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Ausgabedatum:
2003-08
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 27 VDE-Artnr.: 210962
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.