IEC 60749-35:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Ausgabedatum:
2006-07
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 43 VDE-Artnr.: 212916
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.