IEC 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Ausgabedatum:
2013-07
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 26 VDE-Artnr.: 220064
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.