IEC 62047-16:2015
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
Ausgabedatum:
2015-03
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 21 VDE-Artnr.: 221521
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 µ to 10 µ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.