IEC 62899-202-11:2025Printed electronics - Part 202-11: Materials - Conductive ink - Measurement method of electrical resistance uniformity for large area printed conductive layer
80,00 €
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IEC 62878-2-603:2025Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
80,00 €
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IEC 60194-2:2025Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies
280,00 €
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IEC 61188-6-3:2024Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
249,99 €
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IEC 61189-2-809:2024Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
40,00 €
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IEC 61189-2-808:2024Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
115,00 €
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IEC 61189-2-805:2024Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
40,00 €
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IEC 62899-202-8:2024Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
80,00 €
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IEC 61189-2-720:2024Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
40,00 €
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IEC TS 62878-2-10:2024Device embedding assembly technology - Part 2-10: Design specification for cavity substrate
40,00 €
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IEC 63251:2023Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
155,00 €
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IEC 61189-2-804:2023Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
20,00 €
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IEC 62899-202-9:2023Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
80,00 €
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IEC 61189-2-801:2023Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
40,00 €
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IEC 61189-2-803:2023Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
20,00 €
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IEC 61249-6-3:2023Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
155,00 €
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IEC TR 61191-9:2023Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
365,00 €
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IEC 61249-2-51:2023Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
115,00 €
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