IEC 62899-202-8:2024

Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials

IEC 61189-2-720:2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

IEC TS 62878-2-10:2024

Device embedding assembly technology - Part 2-10: Design specification for cavity substrate

IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

IEC 63055:2023

Format for LSI-Package-Board Interoperable design

IEC 61189-2-804:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

IEC 62899-202-9:2023

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

IEC 61249-6-3:2023

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards

IEC TR 61191-9:2023

Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices

IEC 61249-2-51:2023

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

IEC 62899-202:2023

Printed electronics - Part 202: Materials - Conductive ink

IEC 62899-202:2023 RLV

Printed electronics - Part 202: Materials - Conductive ink

IEC PAS 61191-10:2022

Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies

IEC TR 62878-2-9:2022

Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries

IEC 61189-2-501:2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

IEC 62899-202-4:2021

Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)

IEC TR 62899-402-4:2021

Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology

IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T_d) using TGA