IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Ausgabedatum:
2023-11
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 42 VDE-Artnr.: 252245
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.