IEC 62969-3:2018Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
150,00 €
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IEC 62969-2:2018Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
40,00 €
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IEC 62969-1:2017Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
75,00 €
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IEC 62047-29:2017Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
75,00 €
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IEC 62047-30:2017Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
115,00 €
|
IEC 60747-16-3:2002/AMD2:2017Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
10,00 €
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IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV (Consolidated Version)Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
320,00 €
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IEC 60747-16-4:2004/AMD2:2017Amendment 2 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
10,00 €
|
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV (Consolidated Version)Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
295,00 €
|
IEC 62951-1:2017Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
75,00 €
|
IEC 62830-3:2017Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
150,00 €
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IEC 62830-1:2017Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
150,00 €
|
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV (Consolidated Version)Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
520,00 €
|
IEC 60747-16-1:2001/AMD2:2017Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
20,00 €
|
IEC 62830-2:2017Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
75,00 €
|
IEC 62047-27:2017Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
75,00 €
|
IEC 62047-28:2017Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
115,00 €
|
IEC 62047-25:2016Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
150,00 €
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IEC 60747-5-7:2016Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
150,00 €
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IEC 62047-26:2016Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
185,00 €
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