IEC 62969-3:2018

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors

IEC 62969-2:2018

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors

IEC 62969-1:2017

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors

IEC 62047-29:2017

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

IEC 62047-30:2017

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

IEC 60747-16-3:2002/AMD2:2017

Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV (Consolidated Version)

Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters

IEC 60747-16-4:2004/AMD2:2017

Amendment 2 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV (Consolidated Version)

Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches

IEC 62951-1:2017

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates

IEC 62830-3:2017

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting

IEC 62830-1:2017

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting

IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV (Consolidated Version)

Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

IEC 60747-16-1:2001/AMD2:2017

Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers

IEC 62830-2:2017

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting

IEC 62047-27:2017

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

IEC 62047-28:2017

Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

IEC 62047-25:2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

IEC 60747-5-7:2016

Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors

IEC 62047-26:2016

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures