IEC 62530:2021SystemVerilog - Unified Hardware Design, Specification, and Verification Language
450,00 €
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IEC 61691-8:2021Behavioural languages - Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual
450,00 €
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IEC 61760-2:2021Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
80,00 €
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IEC 61760-2:2021 RLVSurface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
136,00 €
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IEC 60068-2-21:2021Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
280,00 €
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IEC TR 62878-2-8:2021Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
80,00 €
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IEC 62878-2-602:2021Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
80,00 €
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IEC 61636:2021Software Interface for Maintenance Information Collection and Analysis (SIMICA)
280,00 €
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IEC 61636-1:2021Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML)
249,99 €
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IEC 60068-2-20:2021 RLVEnvironmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
196,00 €
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IEC 60068-2-20:2021Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
115,00 €
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IEC TR 61191-8:2021Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
249,99 €
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IEC 61189-5-301:2021Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
249,99 €
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IEC 61188-6-1:2021Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
249,99 €
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IEC 60194-1:2021Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
450,00 €
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IEC 61188-6-2:2021Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
155,00 €
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IEC 61189-5-502:2021Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
155,00 €
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IEC 61189-5-601:2021Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
249,99 €
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IEC 61760-3:2021Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
200,00 €
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