IEC 61189-5-503:2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

IEC 62090:2017

Product package labels for electronic components using bar code and two-dimensional symbologies

IEC 61188-7:2017

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

IEC TR 61189-3-914:2017

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

IEC 60068-2-69:2017

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

IEC TR 63051:2017

Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)

IEC 62739-3:2017

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

IEC 61636:2016

Software interface for Maintenance Information Collection and Analysis (SIMICA)

IEC 61636-1:2016

Software interface for maintenance information collection and analysis (SIMICA): Exchanging test results and session information via the extensible markup language (XML)

IEC 61636-99:2016

Software Interface for Maintenance Information Collection and Analysis (SIMICA): Common Information Elements

IEC 63055:2016

Format for LSI-Package-Board Interoperable design

IEC TS 61189-3-301:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

IEC 62739-2:2016

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

IEC 61189-2-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

IEC 61189-5-1:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IEC 60068-3-13:2016

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

IEC 61249-2-44:2016

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 61249-2-43:2016

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 61671-2:2016

Standard for automatic test markup language (ATML) instrument description

IEC 61671-4:2016

Standard for automatic test markup language (ATML) test configuration