IEC 61189-5-301:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

IEC 60194-1:2021

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

IEC 61189-5-502:2021

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies

IEC 61189-5-601:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

IEC 61760-3:2021

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

IEC 61189-5-501:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

IEC TR 61188-8:2021

Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

IEC 61760-1:2020

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

IEC 61189-5-504:2020

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

IEC TR 61191-7:2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC 61191-2:2017/COR1:2019

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

IEC 62878-2-5:2019

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

IEC TR 61189-5-506:2019

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

IEC 60068-2-69:2017+AMD1:2019 CSV (Consolidated Version)

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

IEC 60068-2-69:2017/AMD1:2019

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

IEC 60068-2-82:2019

Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design