1
A Study on the Impact of Polymer Additives in Bulk Copper Slurry on Copper CMP
Authors:
Chou, Homer; Kim, Wonlae; Noh, Jongil; Lee, Inkyung
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
2
Accelerating Development Timeframes Through Effective Use of CMP Outsourcing
Authors:
Carroll, Roger; Rhoades, Robert L.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
3
Advanced W-CMP Slurry for High Planarity
Authors:
Tanaka, Rika; Haruki, Nojo; Yoshida, Koichi; Isobe, Akira
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
4
Application of CMP to the Cladding Layer of MRAM
Authors:
Wang, Shih-Hui; Lin, Ke-Chin; Yen, Cheng-Tyng; Shu, Dun-Ying; Kao, M. J.; Tsai, Ming-Jinn
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
5
Application of the Copper Damascene Process for the Preparation of Electromigration Test Structures
Authors:
Stangl, M.; Acker, J.; Acker, J.; Hoffmann, V.; Wetzig, K.; Künzelmann, U.; Bartha, J. W.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
6
Applications of Shear Force Spectral Analysis in STI CMP
Authors:
Sampurno, Y.; Sudargho, F.; Sudargho, F.; Zhuang, Y.; Zhuang, Y.; Ashizawa, T.; Morishima, H.; Philipossian, A.; Philipossian, A.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
7
Challenges in CMP of New Materials from Carbon Nanotubes to Moisture Sensitive Surfaces
Authors:
Li, Yuzhuo
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
8
Characterization of Residual Stress Change of Dielectrics in W-CMP Process Using Finite Element Method Analysis
Authors:
Fukuda, Akira; Mochizuki, Yoshihiro; Hiyama, Hirokuni; Tsujimura, Manabu
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
9
CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices
Authors:
Gottfried, Knut; Schubert, Ina; Schulze, Knut; Schulz, Stefan; Gessner, Thomas; Gessner, Thomas
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
10
CMP Modeling as a part of Design for Manufacturing
Authors:
Tripathi, Shantanu; Monvoisin, Adrien; Dornfeld, David; Doyle, Fiona M.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
11
CMP of a Ru based layer in an advanced Cu low-k stack
Authors:
Vaes, Jan; Sinapi, Fabrice; Hernández, José Luis; Santoro, Gaetano; Nguyen, Olivier; Wang, James
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
12
Conditioning of CMP Pad to Reinstate Pad Surface Functions
Authors:
Kadomura, Kazunori; Fukunishi, Toshio; Umezaki, Yoji; Matsukawa, Yoji; Kurokawa, Syuhei; Doi, Toshiro K.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
13
Control of Flatness for Chemical Mechanical Planarization
Authors:
Nutsch, A.; Pfitzner, L.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
14
Copper Oxidization Formation Analysis for Improving TDDB Reliability
Authors:
Yamada, Yohei; Yagi, Yasuhito; Konishi, Nobuhiro; Ogiso, Naohito; Katsuyama, Kiyomi; Asaka, Shoji; Noguchi, Junji; Miyazaki, Tadakazu
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
15
Damascene Metal Gate Technology: A Front-end CMP Based Universal Platform for High-k Evaluation at the Device Level
Authors:
Endres, Ralf; Schwalke, Udo
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
16
Defectivity Improvement for Fixed Abrasive Based STI CMP in Advanced Logic Technology
Authors:
Reinhold, Birgit; Gagliardi, John J.; Endle, Sue
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
17
Development of AE Monitoring System for CMP Process
Authors:
Park, Sunjoon; Joo, Sukbae; Kim, Youngjin; Jeong, Haedo; Kim, Hyungjae
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
18
Development of Planarity Improved Abrasive-Free Copper CMP Slurry and Practical Non-Selective Barrier CMP Slurry Based on Electrochemical Study
Authors:
Amanokura, Jin; Mabuchi, Katsumi; Sakurada, Takafumi; Nomura, Yutaka; Habiro, Masanobu; Akahoshi, Haruo
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
19
Development of Post Ru CMP Cleaning Solutions
Authors:
Kim, In-Kwon; Cho, Byung-Gwun; Kim, Tae-Gon; Park, Jin-Goo
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology
20
Effect of Ceria Size and Concentration in Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP)
Authors:
Pandija, S.; Crinière, G.; Ceintrey, C.; Babu, S. V.
Conference:
ICPT 2007 - International Conference on Planarization / CMP Technology