1
Sintering technology used for interconnection of large areas: potential and limitation for power modules
Autoren:
Licht, Thomas; Speckels, Roland; Thoben, Markus
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
2
Solar Power Inverters
Autoren:
Mallwitz, Regine; Engel, Bernd
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
3
System based optimization of the chip size and the thermal path for Si and SiC semiconductors
Autoren:
Köneke, Thies; Merkert, Arvid; Mertens, Axel
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
4
The Future of Wire Bonding is? Wire Bonding!
Autoren:
Siepe, Dirk; Bayerer, Reinhold; Roth, Roman
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
5
Thermal pre-dimensioning methodology based on thermal impedance
Autoren:
Dubus, Patrick; Leon, Renan; Guyader, Delphine Le; Caves, Laurent
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
6
Thermo-mechanical stress analysis for a multilayer SMT manufacturing technology
Autoren:
Josifovic, I.; Popovic-Gerber, J.; Ferreira, J. A.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
7
Three-stage DC-DC converter solutions for SMPS applications in comparison
Autoren:
Schwalbe, Ulf; Scherf, Marko; Reimann, Tobias
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
8
Validation of a Fast Loss and Temperature Simulation Method for Power Converters
Autoren:
Bryant, A. T.; Parker-Allotey, N.-A.; Swan, I. R.; Hamilton, D. P.; Mawby, P. A.; Ueta, T.; Nisijima, T.; Hamada, K.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
9
Vaporizable Dielectric Fluid Cooling for IGBT Power Semiconductors
Autoren:
Saums, David L.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems