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1

Sintering technology used for interconnection of large areas: potential and limitation for power modules

Autoren:
Licht, Thomas; Speckels, Roland; Thoben, Markus
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

2

Solar Power Inverters

Autoren:
Mallwitz, Regine; Engel, Bernd
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

3

System based optimization of the chip size and the thermal path for Si and SiC semiconductors

Autoren:
Köneke, Thies; Merkert, Arvid; Mertens, Axel
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

4

The Future of Wire Bonding is? Wire Bonding!

Autoren:
Siepe, Dirk; Bayerer, Reinhold; Roth, Roman
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

5

Thermal pre-dimensioning methodology based on thermal impedance

Autoren:
Dubus, Patrick; Leon, Renan; Guyader, Delphine Le; Caves, Laurent
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

6

Thermo-mechanical stress analysis for a multilayer SMT manufacturing technology

Autoren:
Josifovic, I.; Popovic-Gerber, J.; Ferreira, J. A.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

7

Three-stage DC-DC converter solutions for SMPS applications in comparison

Autoren:
Schwalbe, Ulf; Scherf, Marko; Reimann, Tobias
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

8

Validation of a Fast Loss and Temperature Simulation Method for Power Converters

Autoren:
Bryant, A. T.; Parker-Allotey, N.-A.; Swan, I. R.; Hamilton, D. P.; Mawby, P. A.; Ueta, T.; Nisijima, T.; Hamada, K.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems

9

Vaporizable Dielectric Fluid Cooling for IGBT Power Semiconductors

Autoren:
Saums, David L.
Konferenz:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems