1
Stabilization of removal rate of silica glass on catalystreferred etching by cleaning catalyst surface
Autoren:
Nakahira, Yuta; Isohashi, Ai; Inada, Tatsuaki; Toh, Daisetsu; Kida, Hideka; Matsuyama, Satoshi; Sano, Yasuhisa; Yamauchi, Kazuto
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
2
STI CMP Endpoint Robustness Improvement through Stribeck Curve Study
Autoren:
Perrot, C.; Bouis, R.; Daventure, N.; Euvrard, C.; Balan, V.
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
3
Study on effect of different complexing agents and inhibitors on Co corrosion in H2O2 based alkaline solution by EQCM
Autoren:
He, Peng; Yang, Guang; Qu, Xin-Ping
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
4
Study on Fullerenol as the Additive to Remove BTA Film Remaining on Copper Surface in Chemical Mechanical Polishing Process
Autoren:
Tsai, Yueh Hsun; Suzuki, Keisuke; Chen, Chao-Chang A.
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
5
Study on the Grit Angle of Single Diamond Dressing on CMP Pads
Autoren:
Chen, Chao-Chang Arthur; Yi-Ting; Li, Tzu-Hao; Hiyama, Hirokuni; Wada, Yutaka; Shiu, Pei-Jiun Ricky; Kimura, Keiichi
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
6
Study on the mechanisms of Si fine polishing with water-soluble polymer
Autoren:
He, Yangang
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
7
Surface Flatness and Roughness Synchronized Control in CMP Process of Silicon Mirror
Autoren:
Jiang, Bocheng; Zhao, Dewen; Lu, Xinchun
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
8
The Behaviours of BTA and SDS in the Alkaline Slurry during the Backside CMP of Heterogeneous Microstructure of TSV Wafers
Autoren:
Wang, BingQuan; Liu, YuHong; Lu, XinChun
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
9
The Effect of chelating Agent in TMAH Based Post Cu-CMP Cleaning Solution
Autoren:
Jeon, Seongsik; Jeon, Sanghyuk; Lim, Ahhyeon; Yi, Sokho; Kim, Taesung
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
10
The effect of surface charge using amino acid and cationic surfactant for high material removal rate (MRR)
Autoren:
Sun, Hanna; Kim, Ye-Chan; Park, In-Kyung; Nam, Jae-Da
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
11
The Numerical Investigation of the Effect of Withdrawing Velocity on Marangoni Drying Performance in the Post CMP Cleaning
Autoren:
Li, Changkun; Zhao, Dewen; Lu, Xinchun
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
12
Torque measurements generated by a rotating PVA brush without a skin layer
Autoren:
Ito, Masayoshi Jr.; Sanada, Toshiyuki; Fukunaga, Akira; Hiyama, Hirokuni
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
13
W CMP Tiny Particle Reduction Solution
Autoren:
Li,Kun; Wang, Tongqing; Zheng, Shumao; Lu, Xinchun
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology