1
New Gate Driver Solutions for Modern Power Devices and Topologies
Autoren:
Herzer, R.
Konferenz:
CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
2
New High Level Integrated Intelligent Power Module with Three Phase Inverter and Power Factor Correction Topologies Optimized for Home Appliances
Autoren:
Jang, Hyosang; Choo, Byoungho; Lee, Junbae; Lee, Minsub; Chung, Daewoong
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
3
New High Power 3.3kV/1500A IGBT Module Packaging
Autoren:
Li, Daohui; Zhou, Wei; Qi, Fang; Packwood, Matthew; Wang, Yangang; Jones, Steve; Dai, Xiaoping
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
4
New High Power Density Modules for EV/HEV Applications
Autoren:
Inokuchi, Seiichiro; Saito, Shoji; Izuka, Arata; Hata, Yuki; Hatae, Shinji; Hussein, Khalid
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
5
New Insights into Turbo-Decoding-Based AVSR with Dynamic StreamWeights
Autoren:
Gergen, Sebastian; Zeiler, Steffen; Abdelaziz, Ahmed Hussen; Kolossa, Dorothea
Konferenz:
Speech Communication - 12. ITG-Fachtagung Sprachkommunikation
6
New interconnect materials: For future high reliable power module assembly
Autoren:
Josso, Stieven
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
7
New LV Wide SOA Power MOSFET technology for Linear Mode operation
Autoren:
Scrimizzi, Filippo; Bazzano, Gaetano; Cavallaro, Daniela; Comola, Marco; Consentino, Giuseppe; Fortuna, Stefania; Longo, Giuseppe; Pignataro, Gaetano
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
8
New Micro-Nano-Technologies and -Components for Complex Sensors using the Example of a Glucose Sensor
Autoren:
Freitag, Hans-Joachim; Winzer, Andreas; Boege, Ludwig
Konferenz:
Mikro-Nano-Integration - 6. GMM-Workshop
9
New silicone gel enabling high temperature stability for next generation of power modules
Autoren:
Seldrum, Thomas; Vanlathem, Eric; Delsuc, Vincent; Enami, Hiroji
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
10
New Transfer Mold DIPIPM(exp TM) utilizing silicon carbide (SiC) MOSFET
Autoren:
Wang, Yazhe; Watabe, Kiyoto; Sakai, Shinji; Tanioka, Toshikazu
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
11
New Transfer Mold type SLIMDIP with RC-IGBT and high precision Short Circuit protection function
Autoren:
Wang, Yazhe; Shibata, Shogo
Konferenz:
PCIM Asia 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
12
New Ultra Fast Short Circuit Detection Method Without Using the Desaturation Process of the Power Semiconductor
Autoren:
Hain, Stefan; Bakran, Mark-M.
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
13
New Ultrafast Laser Sources and Nonlinear Devices Based on TM:II-VI Semiconductors
Autoren:
Vasilyev, Sergey; Moskalev, Igor; Mirov, Mike; Smolski, Viktor; Mirov, Sergey; Gapontsev, Valentin
Konferenz:
ECOC 2016 - 42nd European Conference on Optical Communication
14
Next Generation Low Cost Space SAR Developments
Autoren:
Doody, Sam; Cohen, Martin; Marquez-Martinez, Jose
Konferenz:
EUSAR 2016 - 11th European Conference on Synthetic Aperture Radar
15
NGA im ländlichen Raum: Erfahrungsbericht aus der Harzregion
Autoren:
Fischer, Ulrich H. P.; Schulze, Hans-Martin; Reinboth, Christian
Konferenz:
Breitbandversorgung in Deutschland - 10. ITG-Fachkonferenz
16
nHPD2 (next High Power Density Dual) with next generation chip suitable for low internal inductance package
Autoren:
Kawase, Daisuke; Nagashima, Kazuhito; Hirayama, Tomohisa; Azuma, Katsunori; Hayakawa, Seiichi; Saito, Katsuaki
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
17
NIA SAR Central Electronics Product
Autoren:
Cohen, Martin; Larkins, Andrew; Watson, Phil
Konferenz:
EUSAR 2016 - 11th European Conference on Synthetic Aperture Radar
18
Niedrigstenergie-Ortungsverfahren nach dem Prinzip der Schwarmintelligenz
Autoren:
Skwarek, Volker; Monecke, Milko
Konferenz:
VDE-Kongress 2016 - Internet der Dinge
19
NoDi*-Diagramm zur Visualisierung von TE bei Gleichspannung
Autoren:
Pirker, Alexander; Schichler, Uwe
Konferenz:
VDE-Hochspannungstechnik 2016 - ETG-Fachtagung
20
Noise & Vibration Levels of modern Electric Motors
Autoren:
Stuckmann, Christoph
Konferenz:
PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management