IEC 62951-1:2017Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
80,00 €
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IEC 62830-3:2017Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
155,00 €
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IEC 62830-1:2017Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
155,00 €
|
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV (Consolidated Version)Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
690,00 €
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IEC 60747-16-1:2001/AMD2:2017Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
20,00 €
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IEC 62830-2:2017Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
80,00 €
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IEC 62047-27:2017Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
80,00 €
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IEC 62047-28:2017Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
115,00 €
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IEC 62047-25:2016Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
155,00 €
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IEC 60747-5-7:2016Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
155,00 €
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IEC 62047-26:2016Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
200,00 €
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IEC 62047-1:2016Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
249,99 €
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IEC 62047-16:2015Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
40,00 €
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IEC 62047-17:2015Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
200,00 €
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IEC 62047-20:2014Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
320,00 €
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IEC 62047-21:2014Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
80,00 €
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IEC 62047-22:2014Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
40,00 €
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IEC 62047-11:2013Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
115,00 €
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IEC 62047-18:2013Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
80,00 €
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IEC 62047-19:2013Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
200,00 €
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