IEC 61189-5-601:2021Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
249,99 €
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IEC 61189-5-501:2021Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
115,00 €
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IEC TR 61188-8:2021Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
115,00 €
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IEC 62899-202-6:2020Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate
80,00 €
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IEC 62899-402-2:2020Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness
80,00 €
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IEC 61189-5-504:2020Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
155,00 €
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IEC TR 61191-7:2020Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
385,00 €
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IEC 62878-1:2019Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
115,00 €
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IEC 62878-2-5:2019Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
320,00 €
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IEC TR 61189-5-506:2019Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
155,00 €
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IEC 62899-204:2019Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
155,00 €
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IEC 61188-6-4:2019Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
280,00 €
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IEC TR 62878-2-7:2019Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
80,00 €
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IEC 62899-202-3:2019Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
80,00 €
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IEC 62899-202-5:2018Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
80,00 €
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IEC 62899-403-1:2018Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
155,00 €
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IEC 61189-2-630:2018Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
20,00 €
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IEC 61249-2-47:2018Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
155,00 €
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IEC 61249-2-45:2018Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
155,00 €
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IEC 61249-2-46:2018Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
155,00 €
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