IEC 60194:2015

Printed board design, manufacture and assembly - Terms and definitions

IEC TS 62878-2-1:2015

Device embedded substrate - Part 2-1: Guidelines - General description of technology

IEC TS 62878-2-3:2015

Device embedded substrate - Part 2-3: Guidelines - Design guide

IEC TS 62878-2-4:2015

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)

IEC 60050-541:1990/AMD1:2015

Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits

IEC 61189-5-2:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

IEC 61189-5-3:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

IEC 61189-5-4:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

IEC PAS 61182-12:2014

Generic requirements for printed board assembly products manufacturing description data and transfer methodology

IEC PAS 61249-8-1:2014

Qualification and performance of electrical insulating compound for printed wiring assemblies

IEC PAS 61249-8-5:2014

Qualification and performance specification of permanent solder mask and flexible cover materials

IEC 60947-4-3:2014

Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads

IEC TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

IEC 61249-4-18:2013

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC 61249-4-19:2013

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC 61189-11:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

IEC 61249-2-27:2012

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-30:2012

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

IEC 61249-2-39:2012

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 61249-2-40:2012

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly