IEC 60749-20-1:2019 RLVSemiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
351,00 €
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IEC 60749-20-1:2019Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
270,00 €
|
IEC 63150-1:2019Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 1: Arbitrary and random mechanical vibrations
235,00 €
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IEC 62951-6:2019Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
150,00 €
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IEC 62951-2:2019Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Evaluation method for electron mobility, sub-threshold swing and threshold voltage of flexible devices
40,00 €
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IEC 60749-18:2019 RLVSemiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
195,00 €
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IEC 60749-18:2019Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
150,00 €
|
IEC 60749-17:2019Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
40,00 €
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IEC 62830-4:2019Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices
235,00 €
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IEC 62951-4:2019Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
80,00 €
|
IEC 62951-5:2019Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
115,00 €
|
IEC 62951-7:2019Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
80,00 €
|
IEC 63068-1:2019Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects
150,00 €
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IEC 63068-2:2019Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
150,00 €
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IEC 62951-3:2018Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging
150,00 €
|
IEC 62435-6:2018Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or finished devices
115,00 €
|
IEC 62969-4:2018Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
115,00 €
|
IEC 62435-4:2018Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
115,00 €
|
IEC 62969-3:2018Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
150,00 €
|
IEC 62969-2:2018Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
40,00 €
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