IEC 61189-5-501:2021Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
115,00 €
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IEC TR 61188-8:2021Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
115,00 €
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IEC 61760-1:2020Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
280,00 €
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IEC 61189-5-504:2020Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
155,00 €
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IEC TR 61191-7:2020Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
385,00 €
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IEC 62878-1:2019Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
115,00 €
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IEC 61191-2:2017/COR1:2019Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
0,00 €
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IEC 62878-2-5:2019Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
320,00 €
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IEC TR 61189-5-506:2019Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
155,00 €
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IEC 60068-2-69:2017+AMD1:2019 CSV (Consolidated Version)Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
580,00 €
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IEC 60068-2-69:2017/AMD1:2019Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
20,00 €
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IEC 60068-2-82:2019Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies
249,99 €
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IEC 61188-6-4:2019Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
280,00 €
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IEC TR 62878-2-7:2019Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
80,00 €
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IEC 61191-1:2018Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
280,00 €
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IEC 61191-1:2018 RLVPrinted board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
476,00 €
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IEC 61189-2-630:2018Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
20,00 €
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IEC 61760-4:2015/AMD1:2018Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
10,00 €
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IEC 61760-4:2015+AMD1:2018 CSV (Consolidated Version)Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
439,99 €
|
IEC 60068-2-69:2017/COR1:2018Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)
0,00 €
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