IEC TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
Ausgabedatum:
2014-05
Edition:
1.0
Sprache: EN-FR - zweisprachig englisch/französisch
Seitenzahl: 187 VDE-Artnr.: 220795
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.