1
1200 V-360 A SiC Power Module with Phase Leg Clustering Concept for Low Parasitic Inductance and High Speed Switching
Authors:
Takao, Kazuto; Shinohe, Takashi; Yamamoto, Takashi; Hasegawa, Kohei; Ishida, Masaaki
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
2
3D Packaging for vertical power devices
Authors:
Rouger, N.; Widiez, J.; Benaissa, L.; Imbert, B.; Gondcharton, P.; Letowski, B.; Crebier, JC.; Letowski, B.
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
3
A Multi-Disciplinary Virtual Prototyping Design Tool for Power Electronics
Authors:
Evans, P. L.; Castellazzi, A.; Johnson, C. M.
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
4
A New Rainflow – free Method to Transfer Irregular Load Mission Profile Data Into appropriate Lab Test Conditions for Design Optimization
Authors:
Aal, Andreas
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
5
A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography
Authors:
Agyakwa, Pearl A.; Yang, Li; Corfield, Martin R.; Johnson, C. Mark
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
6
A proposal of embedded SoC power supply compatible with a digital block design flow
Authors:
Souvignet, Thomas; Allard, Bruno; Trochut, Severin; Hasbani, Frederic
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
7
A real time measurement of junction temperature variation in high power IGBT modules for wind power converter application
Authors:
Ghimire, Pramod; Pedersen, Kristian Bonderup; Vega, Angel Ruiz de; Rannestad, Bjorn; Munk-Nielsen, Stig; Thogersen, Paul Bach
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
8
A Simple Method to Evaluate Substrate Layout for Power Modules
Authors:
Zhu, Nan; Chen, Min; Xu, Dehong
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
9
Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling
Authors:
Heuck, N.; Guth, K.; Thoben, M.; Mueller, A.; Oeschler, N.; L. Boewer; Speckels, R.; Krasel, S.; Ciliox, A.
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
10
An Improved Method of Controlling IGBT Modules Using an Optimized Gate Current Waveform
Authors:
Cenusa, Marius; Cretu, Gabriel; Pfost, Martin
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
11
Analyzing the State of Health of Diode Layers by using Structure Functions
Authors:
Richter, Martin; Kopp, Michael; Schroth, Ruediger; Lutz, Josef
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
12
Application of Silver Nano Particle to Pressureless Bonding onto a Copper Surface - Consideration of Substitute Material for Lead Solder
Authors:
Miyoshi, Hiromasa; Endoh, Keiichi; Kurita, Satoru
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
13
Breakthrough into the third dimension – Sintered multi layer flex for ultra low inductance power modules
Authors:
Beckedahl, Peter; Spang, Matthias; Tamm, Oliver
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
14
Challenges on Diagnostics of Power Electronics Modules and Assemblies
Authors:
Albrecht, H.-J.; Busche, N.; Strogies, J.; Wilke, K.; Schuster, M.; Cassigniol, C.
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
15
Characterization of different wire bonding materials during passive thermal test
Authors:
Cosiansi, Fernando; Mattiuzzo, Emilio; Turnaturi, Marcello; Thomas, Sven; Koetter, Steffen
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
16
Comparison of thermo-mechanical reliability of high-temperature bonding materials for attachment of SiC devices
Authors:
Li, Jianfeng; Yaqub, Imran; Corfield, Martin; Agyakwa, Pearl; Johnson, Christopher Mark
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
17
Conducted EMI and Systems Integration
Authors:
Boroyevich, Dushan; Zhang, Xuning; Bishinoi, Hemant; Burgos, Rolando; Mattavelli, Paolo; Wang, Fred
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
18
Controlling of Power Electronic Modules by a 2-Wire-Connection with Combined Signal and Power Transfer
Authors:
Endres, Stefan; Zeltner, Stefan
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
19
Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding
Authors:
Unger, Andreas; Sextro, Walter; Althoff, Simon; Meyer, Tobias; Neumann, Klaus; Reinhart, René Felix; Broekelmann, Michael; Guth, Karsten; Bolowski, Daniel
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
20
DCB-based low-inductive SiC modules for high frequency operation
Authors:
Meisser, Michael; Hamilton, Dean; Mawby, Philip
Conference:
CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems