1
10 kV SiC Power Module Packaging
Autoren:
Johnson, Mark; DiMarino, Christina; Mouawad, Bassem; Li, Jianfeng; Skuriat, Robert; Wang, Meiyu; Tan, Yansong; Lu, G. Q.; Burgos, Rolando
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
2
A 3.3 kV SiC MOSFET Half-Bridge Power Module
Autoren:
Mouawad, Bassem; Hussein, Abdallah; Castellazzi, Alberto
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
3
A correlative approach to observing the thermomechanically driven microstructural evolution of ultrasonically bonded copper wires
Autoren:
Mouawad, Bassem; Agyakwa, Pearl; Corfield, Martin; Johnson, C. Mark
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
4
A Fully-Isolated Robust Common-Mode Hybrid Filter
Autoren:
Mollov, Stefan
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
5
A High Efficiency and Power Density, High Step-Up, Non-isolated DC-DC Converter Based on Multicell Approach
Autoren:
Andreta, Andre G.; Lamorelle, Theo; Lembeye, Yves; Kerachev, Lyubomir; Sarrafin, Farshid; Fernando, Luiz; Villa, Lavado; Crebier, Jean Christophe
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
6
A High Performance 1200 V/120 A SiC Power Module Based On a Novel Multi-DBCs Hybrid Packaging Structure
Autoren:
Li, Yuxiong; Huang, Zhizhao; Chen, Lichuan; Chen, Cai; Zou, Kaifeng; Kang, Yong; Luo, Fang; Li, Sichao
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
7
A mitigation solution for bifurcations in a low-power 4-Switch Buck-Boost converter (4SBB)
Autoren:
Malou, Amokrane; Allard, Bruno; Lin-Shi, Xuefang; Hijazi, Alaa; Le Men, Berengere
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
8
A Novel Double Sided Cooled Leadframe Power Module for Automotive Application based on ceramic-free Substrates
Autoren:
Ngoc An, Bao; Kaestner, Peter; Meisser, Michael; Leyrer, Benjamin; Demattio, Horst; Noetzel, Dorit; Scherer, Torsten; Mail, Matthias; Kolb, Johannes; Blank, Thomas; Weber, Marc; Hannemann, Thomas
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
9
A Novel Gate Driving Approach to Balance the Transient Current of Parallel-Connected GaN-HEMTs
Autoren:
Hackel, Jonathan; Ebli, Michael; Pfost, Martin
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
10
A SiC MOSFET Power ModuleWith Integrated Gate Drive for 2.5 MHz Class E Resonant Converters
Autoren:
Jorgensena, Asger Bjorn; Nairb, Unnikrishnan Raveendran; Munk-Nielsena, Stig; Uhrenfeldt, Christian
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
11
A transfer-molded high temperature SiC power module withstanding up to 250 °C
Autoren:
Mitamura, Kazuhiro; Ozaki, Yui; Murakami, Yoshinori; Takahashi, Hiroki; Tanisawa, Hidekazu; Koui, Kenichi; Kato, Fumiki; Sato, Shinji; Yamaguchi, Hiroshi; Sato, Hiroshi
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
12
Additive Manufacturing of 3D-copper-metallizations on alumina by means of Selective Laser Melting for power electronic applications
Autoren:
Stoll, Thomas; Kirstein, Matthias; Franke, Joerg
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
13
Advanced Die-attach by Metal-powder Sintering: The Science and Practice
Autoren:
Lu, Guo-Quan; Wang, Meiyu; Mei, Yunhui; Li, Xin
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
14
Advantages of Gallium Nitride over Silicon transistors in softswitched Resonant Switched Capacitor Converters
Autoren:
Serrano, Diego; Toral, Victor; Vasic, Miroslav; Oliver, Jesus Angel; Alou, Pedro; Cobos, Jose A.
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
15
An Investigation of Frequency Response Analysis Method for Junction Temperature Estimation of SiC Power Device
Autoren:
Lu, Xiang; Chen, Cuili; Al-Greer, Maher; Pickert, Volker; Tsimenidis, Charalampos
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
16
An Investigation of the Parasitic Impedance on the DC-Link Capacitor of EV Drive Inverters
Autoren:
Piepenbreier, Stefan; Kaess, Albert; Maerz, Martin
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
17
Analysis of Transient Thermal-Mechanical Stresses in Power Devices Using Test Chips and Optical Techniques
Autoren:
Feisst, Markus; Moeller, Eike; Wilde, Juergen
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
18
Analytics for Power Electronic Components - Methods to figure out root causes of failures
Autoren:
Petzold, Matthias; Klengel, Sandy; Boettge, Bianca; Tismer, Sebastian; Patzig, Christian; Brand, Sebastian; Altmann, Frank
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
19
Applying magnetoresistive current sensors in difficult operating environments
Autoren:
Slatter, Rolf; Brusius, Matthias; Glenske, Claudia
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20
Automotive Qualification Routines for Power Electronics Components in Electrified Powertrains
Autoren:
Rittner, Martin; Thoben, Markus; Kriegel, Kai
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems