1
A study of CMP Edge Profile for Production Wafers
Autoren:
Isobe, Akira
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
2
A Study of Cu inhibitor removal by alkaline agent in post CMP cleaning process
Autoren:
Gao, Baohong; Tan, Baimei; Liu, Yuling
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
3
Advanced Optical Particle Sizing for Non-Invasive Slurry analysis
Autoren:
Mavliev, Rashid
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
4
Application of Machine Learning and Neural Networks for Generation of Pre-CMP Profiles of Advanced Deposition Processes for CMP Modeling
Autoren:
Ghulghazaryan, Ruben; Wilson, Jeff
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
5
Application of Slurry Injection System (SIS) to Advanced Deep-Trench (DT) CMP
Autoren:
Jha, Amarnath; Stoll, Derek; Tseng, Wei-Tsu; Wu, Changhong; Yang, Ji Chul; Philipossian, Ara
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
6
Atomic Insights into Material Removal Mechanisms in Si and Cu Chemical Mechanical Polishing Processes: ReaxFF Reactive Molecular Dynamics Simulations
Autoren:
Wen, Jialin; Ma, Tianbao; Lu, Xinchun; Zhang, Weiwei; van Duin, Adri C.T.
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
7
BEoL post CMP cleaning challenges for 22 nm FD-SOI and beyond
Autoren:
Koch, Johannes; Rehschuh, Stephan; Gerlich, Lukas; Dhavamani, Abitha; Steinke, Philipp; Krause, Robert; Naue, Johannes; Bott, Sascha; Vasilev, Boris; Breuer, Dirk; Seidel, Robert; Preusse, Axel; Bartha, Johann Wolfgang; Uhlig, Benjamin
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
8
Carbon Compound Particle Residue Defect Remove by CMP Post Clean
Autoren:
Chen, Shih-Hsi; Yen, Shih-Ci; Chen, Ming-Hsiang; Chen, Ming-Hong; Liu, Chiao-Wei
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
9
Chemical Generation Mechanism of Copper Flakes on Copper Wafer Surface from CMP Slurry and Post CMP Cleaning Chemistry
Autoren:
Cho, Byoung-Jun; Paluvai, Nagarjuna R.; Purushothaman, Muthukrishanan; Lee, Jung-Hwan; Shima, Shohei; Hiyama, Hirokuni; Park, Jin-Goo
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
10
Chemical Mechanical Polishing of SiC Substrate Using Enhanced Slurry Containing Nanobubbles with Active Gas Generated by Plasma
Autoren:
Mizuuchi, Shinya; Uneda, Michio; Shibuya, Kazutaka
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
11
Chemo-Mechanical Planarization of Germanium Using Potassium Periodate based Titania Slurries
Autoren:
Gupta, Apeksha; Victoria, S. Noyel; Manivannan, R.
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
12
Cherishing Old Knowledge, Acquiring New - Past, Present and Future of CMP Technology
Autoren:
Tsujimura, Manabu
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
13
CMP Process for (110)-Germanium Roughness Reduction
Autoren:
Lisker, Marco; Krueger, Andreas; Lupina, Grzegorz; Yamamoto, Yuji; Mai, Andreas
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
14
CMP Process for Wafer Backside Planarization
Autoren:
Krueger, Andreas; Lisker, Marco; Trusch, Andreas; Mai, Andreas
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
15
Control of Silica Particle Deposition for Fabrication of Post CMP Cleaning Ability Evaluation Wafer
Autoren:
Cho, Younsun; Chae, Seung-Ki; Shin, Cheolmin; Jin, Yinhua; Kim, Taesung
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
16
Controllable CMP of Oxide Film by Using Colloidal Ceria Slurry
Autoren:
Kurokawa, Syuhei; Toyama, Takaaki; Hayashi, Terutake; Suda, Eisaku; Tokuda, Jun
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
17
Corrosion inhibition of Cobalt during post-Chemical Mechanical Planarization Cleaning
Autoren:
Shibata, Toshiaki; Kusano, Tomohiro; Harada, Ken; Takeshita, Kan; Kawase, Yasuhiro
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
18
Cu Barrier Metal Slurry for Reducing Defect-Level and Enhancing Removal Performances
Autoren:
Hong, Seungchul; Lim, Jinhyuk; Kang, Hyungoo; Jin, Gyuan; Kim, Byoungsoo; Lee, Seunghyun; Kim, Youngho
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
19
Density Evaluation of Sub-100 nm Particles by Using Ellipsometry
Autoren:
Kondoh, Eiichi; Suzuki, Katsuya; Jin, Lianhua; Hamada, Satomi; Shima, Shohei; Hiyama, Hirokuni
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
20
Development of Advanced CMP Process for the Minimization of Hydrophobic Interaction based on the Surface Treatment Technology
Autoren:
Kim, Hyuk-Min; Heo, Jee-Hwan; Kang, Jung-Eun; Park, Seung-Ho; Park, Jong-Hyuk; Yoon, Il-Young; Yoon, Bo-Un; Nam, Seok-Woo
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology