Anzeige
Sortierung
Seite 3 von 4

41

Integrated Profile Control from ECP to CMP

Autoren:
Stöckgen, Uwe; Wehner, Susanne; Preuße, Axel; Heinrich, Jens; Groschopf, Johannes
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

42

Integrative Defect Density Reduction at STI CMP

Autoren:
Becker, Ralf; Tittes, Wolfgang; Boenicke, Andreas; Peters, Stefan; Probst, Marc; Schulze, Daniel; Cwikla, Sebastian; Loesch, Stefan
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

43

Large particle counting for quality control of CMP slurries

Autoren:
Nogowski, A.; Stintz, M.; Barthel, H.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

44

Laser Scattering Technique for Characterizing Defects and Surface Morphology in the Fixed Abrasive CMP Process

Autoren:
Mahajan, Uday; Zhang, Haiping; Douglas, Carlotte; Gagliardi, John; Olson, Erik
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

45

Major Influences of Shaping and Profiling of Cu ECP and CMP on Feature Level

Autoren:
Marxsen, Gerd; Merbeth, Thomas; Nopper, Markus; Ortleb, Thomas; Lehr, Matthias U.; Roessler, Thomas
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

46

Material & Design Considerations for Zero Defect CMP Pads7

Autoren:
Carpio, R.; Tolic, F.; Hymes, S.; Bajaj, R.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

47

Materials Challenges in Planarization and Interconnect Technologies

Autoren:
Moinpour, Mansour
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

48

Modeling for pad wear control during conditioning in CMP

Autoren:
Kasai, Toshi; Anjur, Sriram; Siriwardane, Haresh; Feeney, Paul
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

49

New Polish Chemistry and Process for Improved Fixed Abrasive CMP Performance

Autoren:
Menk, G.; Marks, R.; Leung, G.; Iyer, A.; Diao, J.; Zhou, Y.; Lee, C.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

50

Next Generation Barrier CMP technology for 45nm and beyond

Autoren:
Ye, Qianqiu Christine; Li, Hugh
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

51

Next Generation Chemical Mechanical Planarization Slurries for Polishing Silicon on Advanced Devices

Autoren:
White, Michael L.; Nam, Chul Woo; Batllo, Francois; Walters, Alicia
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

52

Novel slurries for achieving a low silicon dioxide and high silicon nitride removal during chemical-mechanical planarization

Autoren:
Natarajan, A.; Veera, Dandu; Babu, S. V.; Babu, S. V.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

53

Optimization of post polish procedure with respect to defect density reduction in oxide CMP processes

Autoren:
Lauber, Heike; Münzberger, Sven
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

54

Optimized and Customized CMP Conditioner Design for Next Generation Oxide/Metal CMP

Autoren:
Hwang, Taewook; Baldoni, Gary; Vedantham, Rama; Puthanangady, Thomas
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

55

Oxide Thickness Profile Measurement by Dispersive White-Light Interferometry in CMP Process

Autoren:
Jeong, Haedo; Park, Boumyoung; Kim, Youngjin; Kim, Hyoungjae; Ghim, Young-Sik; You, Joonho; Kim, Seung-Woo
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

56

Pad Roughness Effects on Removal Rate and Selectivity in a STI Ceria CMP Process

Autoren:
Meyer, Frank C.; Kuo, Chi-Hsiang; Rudolph, Catharina; Faustmann, Peter
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

57

Pad Surface Analysis and Conditioning Effects: Implications on Process Design, Break-in Response and Next Generation Pad and Conditioning Platforms

Autoren:
Lawing, Andrew Scott; Juras, Chris
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

58

Pad SurfaceMicrostructure and Optimization of the Conditioning Sweep

Autoren:
Borucki, L.; Wei, X.; Zhuang, Y.; Zhuang, Y.; Philipossian,  A.; Philipossian,  A.; Slutz, D.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

59

Planarization of the Poly-Si gate for Non Volatile Memories

Autoren:
Baud, L.; Canevari, L.; Romanelli, C.; Spinolo, G.; Rivoire, M.
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology

60

Point of Use Quality Control of CMP Slurries

Autoren:
Hinze, Frank; Altmann, Justus
Konferenz:
ICPT 2007 - International Conference on Planarization / CMP Technology