41
Integrated, High-Frequency DC-DC Converter Technologies Leading to Monolithic Power Conversion
Autoren:
Lotfi, Ashraf W.; Li, Qiang; Lee, Fred C.
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
42
Integration of Leakage Inductance in Tape Wound Core Transformers for Dual Active Bridge Converters
Autoren:
Cougo, Bernardo; Kolar, Johann W.
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
43
Laminated Bus Bar Structure for Low Induced Noise
Autoren:
Ariga, Zen-nosuke; Wada, Keiji
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
44
Lifetime Evaluation of IGBT Power Modules Applying a Nonlinear Saturation Voltage Observer
Autoren:
Wagenitz, Dennis; Hambrecht, Andreas; Dieckerhoff, Sibylle
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
45
Low-pressure (< 5 MPa) Low-temperature Joining of Large-area Chips on Copper Using Nanosilver Paste
Autoren:
Zheng, Hanguang; Zheng, Hanguang; Calata, Jesus; Calata, Jesus; Ngo, Khai; Ngo, Khai; Luo, Susan; Lu, Guo-Quan; Lu, Guo-Quan; Lu, Guo-Quan
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
46
Micro-fabricated thin-film inductors for on-chip power conversion
Autoren:
Harburg, Daniel V.; Yu, Xuehong; Herrault, Florian; Levey, Christopher G.; Allen, Mark G.; Sullivan, Charles R.
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
47
Microstructural and Mechanical Characterization of Ceramic Substrates with Different Metallization for Power Applications
Autoren:
Böttge, Bianca; Klengel, Sandy; Schischka, Jan; Lorenz, Georg; Knoll, Heiko
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
48
Mixed-Signal and Smart-Power Capable Hybrid Structured ASIC for Cost-Aware Single-Chip Integration of Industrial Applications
Autoren:
Zhang, Yipin; Scherjon, Cor; Burghartz, Joachim N.
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
49
New assembly and interconnect technologies for power modules
Autoren:
Guth, K.; Oeschler, N.; Böwer, L.; Speckels, R.; Strotmann, G.; Heuck, N.; Krasel, S.; Ciliox, A.
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
50
New Methods Help Better Evaluate Risks Via Simulation
Autoren:
Schingale, Angelika; Wolf, Daniela; Schießl, Andreas; Tarnovetchi, Marius
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
51
Planar Interconnect Technology for Power Module System Integration
Autoren:
Weidner, K.; Kaspar, M.; Seliger, N.
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
52
Quality evaluation for silver sintering layers in power electronic modules
Autoren:
Rudzki, Jacek; Jensen, Lars; Poech, Max; Schmidt, Lothar; Osterwald, Frank
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
53
Radial-Anisotropy Thin-Film Magnetic Material for High-Power-Density Toroidal Inductors
Autoren:
Qiu, Jizheng; Sullivan, Charles R.
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
54
Reducing expenditure with cooling in renewable power conversion systems with innovative SiC switches
Autoren:
Araujo, Samuel; Zacharias, Peter
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
55
Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure
Autoren:
Liang, Zhenxian; Ning, Puqi; Wang, Fred; Marlino, Laura
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
56
Reliability Comparison of a Dual Boost and a Triangular Current Mode Resonant-Transition PFC Converter Topology
Autoren:
Allemann, S.; Biela, J.; Held, M.
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
57
Reliability driven virtual prototyping of power electronic equipment - a case study
Autoren:
Huesgen, Till; Riedel, Gernot J.; Drofenik, Uwe
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
58
Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modeling and Experimental Results
Autoren:
Riedel, G. J.; Schmidt, R.; Liu, C.; Beyer, H.; Alaperä, I.
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
59
Reliability of Planar SKiN Interconnect Technology
Autoren:
Scheuermann, Uwe
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
60
Reliability of Power Electronics Under Thermal Loading
Autoren:
McCluskey, Patrick
Konferenz:
CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems