41
IGBT current filamentation observation by segmented collector sensing under UIS condition
Autoren:
Matsuura, Seiya; Tsukuda, Masanori; Omura, Ichiro
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
42
Impact of load-pulse duration on power-cycling capability of SiC devices
Autoren:
Salmen, Paul; Methfessel, Torsten; Kuenzel, Cesare; Schilling, Oliver
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
43
Impact of multilevel converters on EMC filter weight of a 70 kVA power drive system for More Electrical Aircraft
Autoren:
Sathler, Hans H.; Nagano, Lucas; Cougo, Bernardo; Costa, Francois; Labrousse, Denis
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
44
Implementation and validation of a dynamic calorimetric method to evaluate the losses in switching discrete power MOSFETs
Autoren:
Tran, Do Phuong Uyen; Lefebvre, Stephane; Avenas, Yvan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
45
Improved Performances of 6,5kV IGBT Module by using Current Source Gate Driver
Autoren:
Escrouzailles, Vincent; Rabasse, Eric; Coiret, Jean-Yves
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
46
Improved Stress Distribution in Railway Traction Converters Using New High Power Half-Bridge Modules
Autoren:
Piton, Michel; Batista, Emmanuel; Escrouzailles, Vincent
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
47
Improvement of High-temperature Reliability of Power Modules by Multi-step Temperature Bonding Process of Zn-Al Solder
Autoren:
Hozoji, Hiroshi; Kato, Fumiki; Sato, Shinji; Sato, Hiroshi; Yamaguchi, Hiroshi
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
48
Influence of process and stress conditions on microstructure and failure mechanisms of second level sintered Ag joints
Autoren:
Weber, Constanze; Hutter, Matthias; Schneider-Ramelow, Martin
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
49
Integration of Printed Electronics with Potted Power Electronic Modules
Autoren:
Zimmermann, Victoria; Zoerner, Alicia; Chen, Weiyi; Yu, Zechun; Jank, Michael P. M.; Bayer, Christoph F.; Schletz, Andreas; Maerz, Martin
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
50
Introducing the LEGO Mission Profile Analysis Methodology
Autoren:
Fogsgaard, Martin Bendix; Iannuzzo, Francesco
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
51
Investigation of the Current Ripple caused by the Main Inverter in the High Voltage DC Bus of Electric Vehicles
Autoren:
Gentejohann, Marius; Schlueter, Michael; Dieckerhoff, Sibylle
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
52
Investigation on static and dynamic behavior of integrated current sensor in Automotive IGBT module with SPICE based model
Autoren:
Adachi, Shinichiro; Otsuki, Masahito; Averous, Nurhan Rizqy; De Doncker, Rik W.
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
53
Is Pressureless Sintering Ready for Power Electronic Modules?
Autoren:
Blank, Thomas; Luh, Matthias; Leyrer, Benjamin; Scherer, Torsten; Trouillet, Vanessa; Pochert, Matthias; Wurst, Helge; An, Bao Ngoc; Weber, Marc; Ishikawa, Dai
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
54
Loop formation effects on the lifetime of wire bonds for power electronics
Autoren:
von Ribbeck, Hans-Georg; Doehler, Torsten; Czerny, Bernhard; Khatibi, Golta; Geissler, Ute
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
55
Low voltage switching cell for high density and modular 3D power module with integrated air-cooling
Autoren:
Bikinga, Wendpanga Fadel; Deffous, Walid; Mezrag, Bachir; Derbey, Alexis; Dumas, Florian; Sarrazin, Benoit; Avenas, Yvan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
56
Low-Inductance DC-link Design dedicated to SiC-based Highly Integrated Inverters
Autoren:
Schnack, Jasper; Golev, Victor; Goerdes, Jan Philipp; Schuemann, Ulf; Mallwitz, Regine; Stahl, Stefan
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
57
Low-inductive SiC H-Bridge for Direct-Inverter-Single-Tooth-Integration (German BMBF Public Funded Research Project ‘VERSE‘)
Autoren:
Reber, Gerhard; Rittner, Martin; Guyenot, Michael; Kessler, Ulrich; Klemm, Alexander; Holz, Rainer; Reinold, Manfred
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
58
Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application
Autoren:
Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Schischka, Jan; Ziesche, Steffen; Pernau, Hans-Fridtjof; Jaegle, Martin; Klengel, Sandy; Kappert, Holger
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
59
Microstructure and Shear Force Correlation After Reliability Testing of Bond Contacts Using Alternative Al Heavy Wire Materials
Autoren:
Klengel, Robert; Groth, Anne; Hempel, Martin; Schischka, Jan; Stephan, Tino; Klengel, Sandy; Schneider-Ramelow, Martin
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
60
Monolithic Integration of Inductive Components in a GaN-on-Si Technology
Autoren:
Basler, Michael; Moench, Stefan; Reiner, Richard; Waltereit, Patrick; Quay, Ruediger; Kallfass, Ingmar; Ambacher, Oliver
Konferenz:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems