1
In-line Real-time Conductivity Technique for Monitoring of Liquid Chemical Concentration during Semiconductor Manufacturing
Autoren:
Jie, Hong; Kulkarni, Atul; Kim, Hyeong-U; Kim, Taesung
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
2
Influence of different polishing parameters on sapphire substrate CMP
Autoren:
Niu, Xinhuan; Zhao, Xin; Yin, Da; Wang, Jianchao; Wang, Chenwei
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
3
Inline Refractive Index Replaces Auto-titration in Qualifying H2O2 Concentration in CMP of Tungsten
Autoren:
Urquhart, Karl; Johnston, Robert; Kavaljer, Marcus
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
4
Innovative CMP Solution for Advanced STI Process
Autoren:
Pan, Ji Gang; Hung, Steve; Zhang, Qiao Feng; Lu, Chen; Cao, Yi; Qian, Bainian; Su, Elton; Yang, William
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
5
Investigation of Mass Transfer Speed Theory on chemical mechanical polishing
Autoren:
Liu, Yuling; Li, Yanlei; Wang, Chenwei; Yang, Liu; Wang, Jianchao
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
6
Investigations of Annealing Effect on TSV CMP
Autoren:
Rao, Can; Wang, Tongqing; Cheng, Jie; Liu, Yuhong; Lu, Xinchun
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
7
Measurement of Removal Force in DI-Water for Fine Particles with Sub-nanoNewton Resolution
Autoren:
Shima, Shohei; Hamada, Satomi; Takatoh, Chikako; Wada, Yutaka; Fukunaga, Akira; Sobukawa, Hiroshi
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
8
Modified Kinematic Model for Predicting Contact Points of Conditioner in CMP
Autoren:
Choi, Jihye; Kim, Eungcher; Shin, Cheolmin; Jin, Yinhua; Kim, Taesung
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
9
Novel Copper Barrier Slurry for Advanced Cu CMP Process
Autoren:
Chao, Lucas; Hung, Steve; Huang, Tommy; Chou, Julia; Yang, William; Luo, Michael; Kuo, Wendy
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
10
Novel Method for Nano-Surface Analysis of Cu CMP Chemicals by AFM and Microfluidic Chip System
Autoren:
Ryu, Heon-Yul; Han, Kwang-Min; Cho, Byoung-Jun; Shima, Shohei; Hamada, Satomi; Hiyama, Hirokuni; Kim, Tae-Gon; Park, Jin-Goo
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
11
Observation of the real contact area between PVA brush and surface using polarization plate and evanescent field
Autoren:
Hanai, Masanao; Sanada, Toshiyuki; Fukunaga, Akira; Hiyama, Hirokuni
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
12
Optimization of Cu Corrosion Inhibitor Concentration to Reduce Organic Defects
Autoren:
Cho, Byoung-Jun; Pyun, Hae-Jung; Shima, Shohei; Hamada, Satomi; Hiyama, Hirokuni; Park, Jin-Goo
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
13
Optimization of WC-Co Composition for CVD Diamond Pad Conditioner
Autoren:
Kim, Myeong-Jun; Ryu, Heon-Yul; Lee, Jung-Hwan; Kim, Ji-Woo; Cho, Sooji; Hyun, Dabin; Jee, Hae-geun; Park, Jin-Goo
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
14
Pad Conditioning for Poromeric Materials
Autoren:
Scott Lawing, Andrew
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
15
Planarization of SiC wafer using photo-catalyst incorporated pad
Autoren:
Zhou, Yan; Pan, Guoshun; Zou, Chunli; Luo, Guihai; Luo, Haimei
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
16
Post-CMP Cleaners for Tungsten Advanced Nodes: 10 nm and 7 nm
Autoren:
Lieten, Ruben R.; White, Daniela; Parson, Thomas; Jenq, Shining; Frye, Don; White, Michael; Teugels, Lieve; Struyf, Herbert
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
17
Preparation of Ordered Mesoporous Si02/Mc N anocomposite Abrasives and Their Chemical Polishing Behavior on Fused Silicon Substrates
Autoren:
Li , Xu; Chunli, Zou; Xin, Zhang; Chengxi, Kang; Guihai, Luo; Guoshun, Pan
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
18
Proposal of Spraying Pure Water Method under the Electric Field and Its Behavior Observation in the Cleaning Process of CMP
Autoren:
Fujimoto, Masanori; Uneda, Michio
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
19
Research on Multi-Method Endpoint Detection in Chemical Mechanical Planarization Process
Autoren:
Li, Hongkai; Lu, Xinchun; Luo, Jianbin
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology
20
Stabilization method of transition metal catalyst for high efficiency catalyst-referred etching (CARE) of silicon carbide
Autoren:
Toh, Daisetsu; Isohashi, Ai; Inada, Tatuaki; Nakahira, Yuta; Kida, Hideka; Matuyama, Satoshi; Sano, Yasuhisa; Yamauchi, Kazuto
Konferenz:
ICPT 2017 - International Conference on Planarization/CMP Technology