1
Fabrication of PCB Embedded 1200V/50A Power Module and Benchmarking with Commercial DBC-based Package
Autoren:
Sharma, Ankit Bhushan; Schnur, Johann; Haag, Niko; Kuwan, Thomas; Stogel, Armin; Huesgen, Till
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
2
FEM based enhancement of system lifetime by improvement of the die top connection of power electronic semiconductors
Autoren:
Becker, Martin; Hinrich, Andreas; Klein, Andreas; Miric, Anton Z.; Fabian, Benjamin; Schmitt, Wolfgang; Kalajica, Marko
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
3
Ferrite embedding for Power SiPs – a packaging view
Autoren:
Thomas, Tina; Schneider-Ramelow, Martin; Hoffmann, Stefan; Becker, Karl-Friedrich; Walter, Hans; Bader, Volker; Braun, Tanja; Hoene, Eckart
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
4
Frequency Optimum of Semiconductor Technologies and State-of-the-Art Magnetic Components on SMPS
Autoren:
Reimann, Tobias; Scherf, Marko
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
5
Full SiC Integrated Power Converter Module with Replaceable Build-ing Blocks
Autoren:
Aliyu, Attahir Murtala; Castellazzi, Alberto; Lasserrre, Philippe; Delmonte, Nicola; Cova, Paolo
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
6
Grid-Connected Three-Phase H-Bridge Inverter with Level Doubling Network Controlled by Staircase Modulation Techniques
Autoren:
Srndovic, Milan; Viatkin, Aleksandr; Grandi, Gabriele
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
7
Highly Reliable Power Modules by Pressureless Sintering
Autoren:
Waltrich, Uwe; Bayer, Christoph Friedrich; Zoetl, Stephanie; Tokarski, Adam; Zischler, Sigrid; Schletz, Andreas; Maerz, Martin
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
8
How asymmetric busbar design causes symmetric switching behavior of paralleled IGBT modules
Autoren:
Wissen, Matthias; Domes, Daniel; Brekel, Waleri; Yilmaz, Koray
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
9
Identifying the Stray Elements of the Experimental Setup Used in the Semiconductor Datasheets
Autoren:
Delhommais, Mylene; Schanen, Jean-Luc; Wurtz, Frederic; Avenas, Yvan; Rigaud, Cecile; Chardon, Sylvain
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
10
Impedance analysis in a co-planar power bus interconnect prototype for low inductance switching
Autoren:
Lin, Xi; Li, Jianfeng; Johnson, C. Mark
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
11
Improvement of Power Module System Solders by Directional Solidification
Autoren:
Hutzler, Aaron; Oetzel, Christoph; Friker, Emil
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
12
Improving 9-150 kHz EMI Performance of Single-Phase PFC Rectifier
Autoren:
Davari, Pooya; Blaabjerg, Frede; Hoene, Eckart; Zare, Firuz
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
13
In-situ condition monitoring system to study the ageing of power semi-conductor devices in photovoltaic inverters
Autoren:
Dbeiss, Mouhannad; Avenas, Yvan; Zara, Henri; Dupont, Laurent
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
14
Innovative Reliable Nitride based Power Devices and Applications ‒ The EU Public Funded Project ‘InRel-NPower‘
Autoren:
Rittner, Martin; Kessler, Ulrich; Naundorf, Joerg; Kriegel, Kai; Schulz, Martin; Meneghesso, Gaudenzio
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
15
Integrated LED Driver based on 800V Si L-IGBTs
Autoren:
Aliyu, Attahir Murtala; Elliott, Alwyn; Pathirana, Vasantha; Udugampola, V. Nishad; Rajaguru, Pushparajah
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
16
Integration Concept for a Traction Inverter with 3D-Printed Embedded Cooling Technology realizing Highest Power Density
Autoren:
Schnack, Jasper; Hilper, Dominik; Schuemann, Ulf; Eisele, Ronald; Osterwald, Frank; Beer, Holger; Ebel, Thomas
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
17
Integration solutions for clean and safe switching of high speed devices
Autoren:
Schanen, Jean-Luc; Jeannin, Pierre-Olivier
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
18
Interpretation of Power Cycling Data derived from transient Cooling Curves
Autoren:
Bayer, Martin; Hartmann, Samuel; Berg, Marianne; Moody, Robert; Paques, Gontran
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
19
Investigation of the usage of a chip integrated sensor to determine junction temperature during power cycling tests
Autoren:
Kempiak, Carsten; Lindemann, Andreas; Thal, Eckhard; Idaka, Shiori
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
20
Investigations on the Evolution of Dynamic Ron of GaN Power Transistors during Switching Cycles
Autoren:
Elharizi, Malika; Khatir, Zoubir; Lallemand, Richard; Ousten, Jean-Pierre
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems