Power Engineering Society in the VDE (ETG); ECPE (Hrsg.)

ETG-Fb. 161: CIPS 2020

11th International Conference on Integrated Power Electronics Systems, Proceedings March, 24 – 26, 2020, Berlin, Germany

ETG-Fachberichte

2020, 616 Seiten, 140 x 124 mm, Slimlinebox, CD-Rom
ISBN 978-3-8007-5225-6, E-Book: ISBN 978-3-8007-5226-3
Persönliche VDE-Mitglieder erhalten auf diesen Titel 10% Rabatt

Inhaltsverzeichnis Vorwort

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS is consequently focused on the following main aspects:
- assembly and interconnect technology for power electronic devices and converters
- integration of hybrid systems and mechatronic systems with high power density
- systems and components operational behaviour and reliability

Basic technologies for integrated power electronic systems as well as upcoming new im-portant applications will be presented in interdisciplinary invited papers.
In 2020 the successful story of CIPS will continue as the conference focus is today more important than ever - increasing functionality, energy efficiency and system reliability while decreasing cost.

We are pleased to welcome all engineers coming from industry and academia engaged in power electronics-related
- system development
- component development
- reliability engineering
- research
Power Engineering Society in the VDE (ETG)
Objectives of the Power Engineering Society in the VDE (ETG) are the interdisciplinary and international cooperation of industry, science, energy suppliers and energy users. The ETG sees itself as representation of interests of electrical power engineering.

European Center for Power Electronics e.V.
The Industrial and Research Network for Power Electronics in Europe was founded in 2003 by leading power electronics industries in order to promote research, education and public relations in this field.

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2

Evaluation of a GaN HEMT Half-Bridge embedded to a Multilayer Aluminum Nitride Substrate

Autoren: Kuring, Carsten; Wolf, Mihaela; Geng, Xiaomeng; Hilt, Oliver; Boecker, Jan; Wieczorek, Nick; Wuerfl, Joachim; Dieckerhoff, Sibylle

3

Surface-Mount Package IPM with Highly Reliable Transfer Molding Resin

Autoren: Hodaka, Rokubuichi,; Harada, Hiroyuki; Sakamoto, Ken; Iwai, Takamasa; Kosugi, Akira; Shikano, Taketoshi; Hiramatsu, Seiki

4

Simple and Precise Calorimetry Method for Evaluation of Losses in Power Electronic Converters

Autoren: Mary, Nicolas; Perrin, Remi; Mollov, Stefan; Buttay, Cyril

5

6

7

Is Pressureless Sintering Ready for Power Electronic Modules?

Autoren: Blank, Thomas; Luh, Matthias; Leyrer, Benjamin; Scherer, Torsten; Trouillet, Vanessa; Pochert, Matthias; Wurst, Helge; An, Bao Ngoc; Weber, Marc; Ishikawa, Dai

8

Comparison of Silver Sintered Assemblies on Non-DCB Substrates

Autoren: Subbiah, Nilavazhagan; Schiffmacher, Alexander; Song, Xiayingfang; Wilde, Juergen

9

Sintered-copper Die-attach: Processing, Properties, and Reliability

Autoren: Wang, Meiyu; Shan, Yanliang; Mei, Yunhui; Li, Xin; Lu, Guo-Quan

10

Thick film paste systems for multifunctional copper power modules

Autoren: Reinhardt, Kathrin; Körner, Stefan; Partsch, Uwe

11

Monolithic Integration of Inductive Components in a GaN-on-Si Technology

Autoren: Basler, Michael; Moench, Stefan; Reiner, Richard; Waltereit, Patrick; Quay, Ruediger; Kallfass, Ingmar; Ambacher, Oliver

12

A 600V GaN-on-Si Power IC with Integrated Gate Driver, Freewheeling Diode, Temperature and Current Sensors and Auxiliary Devices

Autoren: Moench, Stefan; Reiner, Richard; Waltereit, Patrick; Hueckelheim, Jan; Meder, Dirk; Quay, Ruediger; Ambacher, Oliver; Kallfass, Ingmar

13

14

Ultra-low loss integrated magnetics platform for high frequency power delivery networks

Autoren: Podder, Pranay; Pavlovic, Zoran; Masood, Ansar; Wei, Guannan; Lordan, Daniel; O’Driscoll, Seamus; Peters, Nicolas; Peng, Lulu; Ali, Zishan; Selvaraj, Lawrence; Cheng, Chor Shu; O’Mathuna, Cian; McCloskey, Paul

15

Thermal Analysis of Power Module with Double Sided Direct Cooling using Ceramic Heat Sinks

Autoren: Botter, Nicolas; Avenas, Yvan; Missiaen, Jean-Michel; Bouvard, Didier; Khazaka, Rabih

16

Low voltage switching cell for high density and modular 3D power module with integrated air-cooling

Autoren: Bikinga, Wendpanga Fadel; Deffous, Walid; Mezrag, Bachir; Derbey, Alexis; Dumas, Florian; Sarrazin, Benoit; Avenas, Yvan

17

Direct heat sink printing on metallized ceramic substrate for power electronics applications: heat treatment identification and its impacts

Autoren: Martin, Elodie; Khazaka, Rabih; Martineau, Donatien; Azzopardi, Stephane; Alexis, Joel

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19

Detecting Three-Phase Power Inverter Output Currents By A Single PCB Current Sensor

Autoren: Bat-Ochir, Bat-Otgon; Bayarkhuu, Battuvshin; Tsukuda, Masanori; Dugarjav, Bayasgalan; Omura, Ichiro

20

Three-State Output Gate Driver for IGBTs

Autoren: Reigosa, Paula Diaz; Urcan, Bogdan Marian; Gascue, Martin Iriondo; Iannuzzo, Francesco

21

Optimisation and Proof of Concept Studies for the M-Shunt Structure applied to Printed Circuit Boards

Autoren: Lutzen, Hauke; Mitsui, Koji; Silber, Dieter; Wada, Keiji; Kaminski, Nando

22

The Opportunities of Integration Technologies for Active and Passive Components

Autoren: Ostmann, Andreas; Hoene, Eckart; Marczok, Christoph

23

System integration and analysis of SiC-based high power inverter with up to 250 kW and switching slopes of up to 50 kV/μs for novel powertrain concepts

Autoren: De Doncker, Rik W.; Fuchs, Lea; Hepp, Maximilian; Luedecke, Christoph; Meyne, Christian; Nisch, Alexander; Otto, Alexander; Reum, Thomas; Rzepka, Sven; Strenger, Christian; Uhlemann, Andre; Vanegas, Omar; Wondrak, Wolfgang

24

PCB Embedded dies for low thickness Wireless rotary transformer

Autoren: Perrin, Remi; Mariani, Guilherme Bueno; Morand, Julien; Mollov, Stefan

25

Integration of Printed Electronics with Potted Power Electronic Modules

Autoren: Zimmermann, Victoria; Zoerner, Alicia; Chen, Weiyi; Yu, Zechun; Jank, Michael P. M.; Bayer, Christoph F.; Schletz, Andreas; Maerz, Martin

26

SiC Power Module with integrated RC-Snubber Design for Voltage Overshoot and Power Loss Reduction

Autoren: Rettner, Cornelius; Schiedermeier, Maximilian; Apelsmeier, Andreas; Heckel, Thomas; Diepgen, Antonia; Klische, Alexander; Dirksen, Daniel; Maerz, Martin

27

Full-SiC Integrated Power Module based on Planar Packaging Technology for High Efficiency Power Converters in Aircraft Applications

Autoren: Raab, Oliver; Guacci, Mattia; Griffo, Antonio; Kriegel, Kai; Heller, Morris; Wang, Jiabin; Bortis, Dominik; Schulz, Martin; Kolar, Johann W.

28

Multi-chip Medium Voltage SiC MOSFET Power Module with Focus on Low Parasitic Capacitance

Autoren: Jorgensen, Jannick K.; Dalal, Dipen Narendra; Beczkowski, Szymon; Munk-Nielsen, Stig; Uhrenfeldt, Christian

29

Ultra-high Power Density Server Supplies Employing GaN Power Semiconductors and PCB-Integrated Magnetics

Autoren: Kasper, Matthias J.; Peluso, Luca; Deboy, Gerald; Knabben, Gustavo; Guillod, Thomas; Kolar, Johann W.

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31

Improvement of High-temperature Reliability of Power Modules by Multi-step Temperature Bonding Process of Zn-Al Solder

Autoren: Hozoji, Hiroshi; Kato, Fumiki; Sato, Shinji; Sato, Hiroshi; Yamaguchi, Hiroshi

32

SiCmodul - Modular high-temperature SiC power electronics for fail-safe power control in electrical drive engineering

Autoren: Marczok, Christoph; Martina, Manuel; Laumen, Michael; Richter, Sebastian; Birkhold, Andreas; Flieger, Bjoern; Wendt, Oliver; Paesler, Thomas

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34

Power Cycling Reliability and Failure Modes in Power Modules with Novel Emitter Contact and Sintering Technologies

Autoren: Beyer, Harald; Maleki, Milad; Bayer, Martin; Koenig, Swen; Fischer, Fabian; Paques, Gontran

35

Power Cycle Testing at Low Temperature Swings – Evaluating the Stability of SAC- and SnSb-based Chip Solder Layers

Autoren: Schmidt, Ralf; Kaesbauer, Michael; Sippel, Marcel; Dreher, Patrick

36

37

Reduction of Common Mode EMI noise in microstrip line based commutation paths designed for sub-nH loop inductance

Autoren: Seliger, Norbert; Dechant, Eduard; Brendel, Christian; Kennel, Ralph

38

Impact of multilevel converters on EMC filter weight of a 70 kVA power drive system for More Electrical Aircraft

Autoren: Sathler, Hans H.; Nagano, Lucas; Cougo, Bernardo; Costa, Francois; Labrousse, Denis

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40

Analysis of the gate driver stray inductance in a Vienna rectifier through parametric Electromagnetic simulations

Autoren: Palomba, Francesco; Gennaro, Francesco; Pavone, Mario; Aiello, Giuseppe; Cacciato, Mario; Muff, Simon; Eichinger, Ludwig

41

Investigation of the Current Ripple caused by the Main Inverter in the High Voltage DC Bus of Electric Vehicles

Autoren: Gentejohann, Marius; Schlueter, Michael; Dieckerhoff, Sibylle

42

Low-Inductance DC-link Design dedicated to SiC-based Highly Integrated Inverters

Autoren: Schnack, Jasper; Golev, Victor; Goerdes, Jan Philipp; Schuemann, Ulf; Mallwitz, Regine; Stahl, Stefan

43

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45

Wideband Macro-Modelling of Power Modules for Transient Electromagnetic Analysis

Autoren: Schroeder, Arne; Wunsch, Bernhard; Kicin, Slavo

46

Thin-film Magnetics-on-Silicon Integrated Transformer for Isolated Signal and Power Coupling Applications

Autoren: Pavlovic, Zoran; Podder, Pranay; Dobbyn, Dermot; Masood, Ansar; Wei, Guannan; Lordan, Daniel; McCloskey, Paul; O’Mathuna, Cian; O’Driscoll, Seamus

47

Digital Gate Drive Control Method for Active Voltage Balancing of Series-connected IGBT Devices

Autoren: Tripathi, Ravi Nath; Arimoto, Takaaki; Tsukuda, Masanori; Omura, Ichiro

48

Ultra-Compact Combined Common Mode (CM)- and Differential Mode (DM)-Inductors

Autoren: Deck, Patrick; Niessen, Martin; Dick, Christian P.

49

PCB Embedded Toroidal Inductor for 2MHz Point-of-Load Converter

Autoren: Murphy, Ruaidhri; Pavlovic, Zoran; McCloskey, Paul; O Mathuna, Cian; O’Driscoll, Seamus; Weidinger, Gerald

50

51

Investigation on static and dynamic behavior of integrated current sensor in Automotive IGBT module with SPICE based model

Autoren: Adachi, Shinichiro; Otsuki, Masahito; Averous, Nurhan Rizqy; De Doncker, Rik W.

52

Improved Performances of 6,5kV IGBT Module by using Current Source Gate Driver

Autoren: Escrouzailles, Vincent; Rabasse, Eric; Coiret, Jean-Yves

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54

Study and Design of an Integrated CMOS Laser Diode Driver for an iToF-based 3D Image Sensor

Autoren: David, Romain; Allard, Bruno; Branca, Xavier; Joubert, Charles

55

Application of Neural Networks to Accelerate Thermomechanical Simulations of Power Modules for Lifetime Prediction

Autoren: Acuna, Javier; Afanasenko, Valentyna; Rupp, Thomas; Sonner, Marcus; Klingler, Markus; Kallfass, Ingmar

56

Deformation Measurements during Active Operation of Power Modules with Novel Assembly and Packaging Technology

Autoren: Schiffmacher, Alexander; Qelibari, Arben; Rudzki, Jacek; Osterwald, Frank; Wilde, Juergen

57

Paste Processing and Structural Properties of Copper Metal-Matrix Composites Containing Short Carbon Fibers

Autoren: Wurst, Helge; Blank, Thomas; Leyrer, Benjamin; Weber, Marc; Ishikawa, Dai

58

Thermal Simulation for Power Density Optimization of SiC-MOSFET Automotive Inverter

Autoren: Becker, Nathalie; Bulovic, Sandro; Bittner, Roland; Herzer, Reinhard

59

Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding

Autoren: Schemmel, Reinhard; Scheidemann, Claus; Hemsel, Tobias; Kirsch, Olaf; Sextro, Walter

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61

Copper wire bonding process characterization and simulation

Autoren: Mancaleoni, Alberto; Sitta, Alessandro; Colombo, Alexandra; Villa, Riccardo; Mirone, Giuseppe; Renna, Marco; Calabretta, Michele

62

PCB layout tool integrated loss and inductance estimation

Autoren: Hoffmann, Stefan; Hoene, Eckart; Schroeder, Bernd; Stube, Bernd; Alraai, Akram; Moritz, Oliver; Mueller, Olaf

63

Design and integration of inductive components for a high-frequency 11 kW / 800 V off-board charger for electric vehicl

Autoren: Schmidhuber, Michael; Drexler, Christoph; Ditze, Stefan; Joffe, Christopher; Ehrlich, Stefan; Arndt, Bastian; Olbrich, Peter; Reindl, Hartwig

64

Low-inductive SiC H-Bridge for Direct-Inverter-Single-Tooth-Integration (German BMBF Public Funded Research Project ‘VERSE‘)

Autoren: Reber, Gerhard; Rittner, Martin; Guyenot, Michael; Kessler, Ulrich; Klemm, Alexander; Holz, Rainer; Reinold, Manfred

65

High Frequency DC-DC Converter for an Integrated Electrical Excitation of an Axial Flux Machine with Fiber-composite Rotor: A Multidisciplinary Approach

Autoren: Schneider, Philipp; Reimann, Tobias; Endert, Fabian; Heidrich, Tobias; Moeckel, Andreas; Neitzel, Benedikt

66

Half-bridge Concepts for High Blocking Voltage GaN HEMTs (EU Public Funded Project ‘InRel-NPower‘

Autoren: Rittner, Martin; Kessler, Ulrich; Konjedic, Tine; Naundorf, Joerg; Kriegel, Kai; Schulz, Martin; Meneghesso, Gaudenzio

67

Two-layered planar SiC power module for industrial applications

Autoren: Raab, Oliver; Kriegel, Kai; Ghesquiere, Pol

68

Characterization of the Junction Temperature of SiC Power Devices via Quasi-Threshold Voltage as Temperature Sensitive Electrical Parameter

Autoren: Sharma, Kanuj; Baron, Kevin Munoz; Ruthardt, Johannes; Hueckelheim, Jan; Kocha, Dominik; Muenzenmayer, Florian; Kallfass, Ingmar

69

Design, Manufacturing and Evaluation of a Highly Integrated Low-Voltage High-Current Inverter

Autoren: Le Lesle, Johan; Quemener, Vincent; Morrand, Julien; Perrin, Remi; Mrad, Roberto; Mollov, Stefan

70

Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board

Autoren: Sewergin, Alexander; Rittner, Martin; Burghardt, Andreas; Kriegel, Kai; Mitic, Gerhard; Zetterer, Thomas; Hutsch, Thomas; Neumann, Albert; Simon, Flaviu; De Doncker, Rik W.

71

PCB Embedded Transformer for Isolated DC-DC Power Supplies

Autoren: Weis, Gerald; Salkovic, Ivan

72

Improved Stress Distribution in Railway Traction Converters Using New High Power Half-Bridge Modules

Autoren: Piton, Michel; Batista, Emmanuel; Escrouzailles, Vincent

73

74

Electrical characteristics of double-sided cooling SiC power module using Ni micro plating bonding

Autoren: Itose, Tomoya; Kawagoe, Akihiro; Imakiire, Akihiro; Kozako, Masahiro; Hikita, Masayuki; Tatsumi, Kohei; Iizuka, Tomonori; Morisako, Isamu; Sato, Nobuaki; Shimizu, Koji; Ueda, Kazutoshi; Sugiura, Kazuhiko; Tsuruta, Kazuhiro

75

Application considerations for Double Sided Cooled Modules in Automotive Environment

Autoren: Moeller, Sebastian; Karimi, Danial; Vanegas, Omar; El Baghdadi, Mohamed; Kospach, Alexander; Lis, Adrian; Rabl, Benedikt; Hegazy, Omar; Abart, Christoph

76

Smart Ultrasonic Welding in Power Electronics Packaging

Autoren: Hunstig, Matthias; Schaermann, Waldemar; Broekelmann, Michael; Holtkaemper, Sebastian; Siepe, Dirk; Hesse, Hans J.

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78

Mechanical and microstructural characterization of LTCC and HTCC ceramics for high temperature and harsh environment application

Autoren: Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Schischka, Jan; Ziesche, Steffen; Pernau, Hans-Fridtjof; Jaegle, Martin; Klengel, Sandy; Kappert, Holger

79

Introducing the LEGO Mission Profile Analysis Methodology

Autoren: Fogsgaard, Martin Bendix; Iannuzzo, Francesco

80

Microstructure and Shear Force Correlation After Reliability Testing of Bond Contacts Using Alternative Al Heavy Wire Materials

Autoren: Klengel, Robert; Groth, Anne; Hempel, Martin; Schischka, Jan; Stephan, Tino; Klengel, Sandy; Schneider-Ramelow, Martin

81

Loop formation effects on the lifetime of wire bonds for power electronics

Autoren: von Ribbeck, Hans-Georg; Doehler, Torsten; Czerny, Bernhard; Khatibi, Golta; Geissler, Ute

82

Thermo-mechanical reliability of nanosilver sintered joints for large-area bonding

Autoren: Dai, Jingru; Bello, Abubakar Umar; Agyakwa, Pearl; Cofield, Martin; Johnson, Christopher Mark

83

84

H3TRB Test on 6.5 kV SiC-JBS Diodes

Autoren: Hoffmann, Felix; Mihaila, Andrei; Soler, Victor; Kaminski, Nando

85

86

Survey on Generative and Discriminative Fault Detection Approaches with Focus on SiC Components

Autoren: Loghmani Moghaddam Toussi, Afshin; Bahman, Amir Sajjad; Blaabjerg, Frede

87

88

Gallium Nitride in Automotive High-Speed Drive Applications

Autoren: Antensteiner, Benjamin; Lamplmayr, Patrick; Moerwald, Michael; Reisinger, Martin; Gruber, Wolfgang; Haeusler, Lukas

89

90

91

Power Cycling of SiC-MOSFET Single-Chip Modules with Additional Measurement Cycles for Life End Determination

Autoren: Wagner, Felix; Reber, Gerhard; Rittner, Martin; Guyenot, Michael; Nitzsche, Maximilian; Wunderle, Bernhard

92

Impact of load-pulse duration on power-cycling capability of SiC devices

Autoren: Salmen, Paul; Methfessel, Torsten; Kuenzel, Cesare; Schilling, Oliver

93

PCB Embedding using Single-Switch-Pre-Packages as Modular Building Blocks

Autoren: Sharma, Ankit Bhushan; Schnur, Johann; Haag, Niko; Polezhaev, Vladimir; Huesgen, Till

94

Generic thermal cooling design for multicell converters

Autoren: Crebier, Jean Christophe; Andreta, Andre; Avenas, Yvan; Lembeye, Yves

95

Electromagnetic switching cell design and characterization for WBG power semiconductors

Autoren: Klein, Kirill; Hoene, Eckart; Lang, Klaus-Dieter

96

IGBT current filamentation observation by segmented collector sensing under UIS condition

Autoren: Matsuura, Seiya; Tsukuda, Masanori; Omura, Ichiro

97

Simultaneous Imaging of Strain and Temperature using Single IR Camera

Autoren: Masuda, Yoshiki; Watanabe, Akihiko; Omura, Ichiro

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99

Dynamic AC Power Cycling with Coupled Inverters Operating Under Application-Oriented Conditions

Autoren: Nitzsche, Maximilian; Baron, Kevin Munoz; Ziegler, Philipp; Wagner, Felix; Roth-Stielow, Joerg

100

Development of sinter paste with surface modified copper alloy particles for die-attach bonding

Autoren: Bhogaraju, Sri Krishna; Conti, Fosca; Schmid, Maximilian; Meier, Markus R.; Schweigart, Helmut; Elger, Gordon

101

Application of response surface methodology for optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging

Autoren: Yu, Zechun; Zeng, Weijian; Bayer, Christoph Friedrich; Schletz, Andreas; Maerz, Martin

102

A New Development of Micro-Copper Sinter Material for High Power Electronics Application

Autoren: Schwarzer, Christian; Chew, Ly May; Stoll, Thomas; Franke, Joerg; Kaloudis, Michael

103

Numerical material design for reliable power electronics with cement-based encapsulation

Autoren: Naumann, Falk; Boettge, Bianca; Behrendt, Stefan; Eisele, Ronald; Klengel, Sandy

104

Present and Future of Fault Tolerant Drives Applied to Transport Applications

Autoren: Deng, Xu; Wu, Haimeng; Gu, Bowen; Atkinson, Glynn; Mecrow, Barrie; Pickert, Volker